Component Carrier Now Replacing Flexible PCBs

April 30, 2020

Flexible circuit boards offer numerous advantages. However, the mechanical fixation of these circuit boards is highly complex. HARTING has developed a new solution based on 3D-MID technology that is capable of replacing flexible circuit boards. Thanks to component carriers, cost savings of up to two-thirds can be achieved.

Flexible printed circuit boards made of thin polyimide films have established themselves in many product areas thanks to their application flexibility. Populating and assembling them, however, is decidedly more complex. This is where a newly developed component carrier from HARTING enters the picture.

A standardised component carrier for electronic components

By harnessing this all new HARTING development, electronic components can be fitted directly onto the component carrier, thereby replacing flexible circuit boards. The component carrier serves as a connecting element between the printed circuit board (PCB) and electronic components such as LEDs, ICs, photodiodes and sensors.

The populated component carriers are delivered in tape & reel. In their standard design, the carriers can be processed in automatic assembly systems, just like other SMD electronic components. Two different sizes are currently available and can accommodate electronic components of standard size SOIC-8 and smaller. Moreover, HARTING can also produce the carriers in customer-specific sizes.

HARTING has identified three example applications where the component carrier can replace flexible circuit boards:

  • Components at a 90° angle to the circuit board: The component carrier is suitable for scenarios in which electrical components, such as sensors, need to be positioned normal to the circuit board. The automatic assembly process enables the placement of temperature sensors or hall sensors on the carrier to a high degree of accuracy, which in turn results in precise, reproducible measurements. Optical components are another salient example, such as LEDs or photodiodes used to generate precise light barriers.
  • Clearance from the circuit board: The component carrier also makes it possible to maintain a clearance between the circuit board and an electronic component. Consequently, a temperature sensor can be used to measure the temperature in the housing without being influenced by the waste heat from other components on the PCB. It also means that an LED can be placed clear of the circuit board, thereby avoiding the risk of surrounding components casting shadows.
  • Antenna function: The component carrier can be manufactured using different base polymers. In this way, different antenna material properties can be factored in, such as dielectric constant and loss factor. The specific antenna layout can be used for various applications in the MHz and GHz frequency range, such as Bluetooth, WiFi, ZigBee and 5G.


3D-MID technology as an alternative to flexible PCBs

Thanks to the 3D-MID (mechatronic integrated device) technology, electronic components can be fitted directly onto a three-dimensional body without the need for circuit boards or connecting cables. The base body is produced through injection moulding, whereby the thermoplastic is provided with a non-conductive, inorganic additive. In order for this material to be able to accommodate electrical circuits, the additives in the plastic are “activated” through laser direct structuring (LDS). In this process, the laser beam writes the areas intended for the conductive tracks and creates a micro-rough structure. The metal particles released in the process form the nuclei for the subsequent chemical metallisation.

This process creates electrical traces across the three-dimensional base body. The plastic employed offers high thermal stability and can therefore be soldered in the reflow oven.

HARTING has been implementing the entire 3D-MID process chain in-house for over 10 years, from the project idea to the populated series product. The technology is finding use in application scenarios in areas such as medical technology, industrial electronics and consumer electronics and all the way through to safety-related components in the automotive industry. The HARTING 3D-MID business unit is the largest provider of 3D-MID components outside of Asia.

The component carrier developed by this process is suitable for various applications. It can be equipped with several sensors that, if desired, could be aligned in three directions to take measurements in three axes (X, Y, Z). Components can be fitted simultaneously on two parallel surfaces on the front and back sides, as well as on the end face. HARTING has submitted a patent application for the component carrier. 

The component carrier cuts costs by two-thirds

In an automated process, HARTING fits electronic components such as LEDs, ICs, photodiodes and sensors directly on the component carrier. The total cost of the component carrier is two-thirds lower than those of flexible PCB solutions. This is due to the fact that it eliminates the frequently complex handling involved with flexible printed circuit boards, e.g. populating, gluing and assembling. The process even delivers benefits in small volumes, as the component carrier can be used for different applications without adaptation, thereby eliminating the costs of a new injection mould. Compared with flexible printed circuit boards, this process achieves more precise component positioning, greater repeatability and better quality.

HARTING has identified another advantage of the component carrier, namely the short timeframe required to deliver finished components. Since the plastic carrier remains unchanged, all that is needed are specifications for placement of the electronic components. Experts in 3D-MID can use this to create a production-optimised layout proposal. Adjustments of the laser program are all that is needed to tailor the electrical traces to the respective application. Once the customer has approved the product and components have been received, initial production samples can be dispatched within two to three weeks – and even faster, if necessary.

For more information, visit www.harting.com.

Related Articles


Changing Scene


Sponsored Content
The Easy Way to the Industrial IoT

The way to the Industrial IoT does not have to be complicated. Whether access to valuable data is required or new, data-driven services are to be generated, Weidmuller enables its customers to go from data to value the easy way. Weidmuller’s comprehensive and cutting-edge IIoT portfolio applies to greenfield and brownfield applications. Weidmuller offers components and solutions from data acquisition, data pre-processing, data communication and data analysis.

Visit Weidmuller’s Industrial IoT Portfolio.


ADVANCED Motion Controls Takes Servo Drives to New Heights (and Depths) with FlexPro Extended Environment Product Line

Advanced Motion Controls is proud to announce the addition of six new CANopen servo drives with Extended Environment capabilities to their FlexPro line. These new drives join AMC’s existing EtherCAT Extended Environment FlexPro drives, making the FlexPro line the go-to solution for motion control applications in harsh environments.

Many motion control applications take place in conditions that are less than ideal, such as extreme temperatures, high and low pressures, shocks and vibrations, and contamination. Electronics, including servo drives, can malfunction or sustain permanent damage in these conditions.

Read More


Service Wire Co. Announces New Titles for Key Executives

Bruce Kesler and Mark Gatewood have been given new titles and responsibilities for Service Wire Co.

Bruce Kesler has assumed the role of Senior Director – Business Development. Bruce will be responsible for Service Wire’s largest strategic accounts and our growing Strategic Accounts Team.

Mark Gatewood has been promoted to the role of Vice President – Sales & Marketing. In this role, Gatewood will lead the efforts of Service Wire Company’s entire sales and marketing organization in all market verticals.

Read More


Tri-Mach Announces the Purchase of an Additional 45,000 sq ft. Facility

Tri-Mach Elmira Facility

Recently, Tri-Mach Inc. was thrilled to announce the addition of a new 45,000 sq ft. facility. Located at 285 Union St., Elmira, ON, this facility expands Tri-Mach’s capabilities, allowing them to better serve the growing needs of their customers.

Positioning for growth, this additional facility will allow Tri-Mach to continue taking on large-scale projects, enhance product performance testing, and provide equipment storage for their customers. The building will also be the new home to their Skilled Trades Centre of Excellence.

Read More


JMP Parent Company, CONVERGIX Acquires AGR Automation, Expanding Global Reach

Convergix Automation Solutions has completed the acquisition of AGR Automation (“AGR”), a UK-based provider of custom, high-performance automation design and systems integration primarily to the life sciences industry.

Following Convergix’s acquisitions of JMP Solutions in August 2021 and Classic Design in February 2022, AGR marks the third investment in Crestview’s strategy to build Convergix into a diversified automation solutions provider targeting the global $500+ billion market, with a particular focus on the $70 billion global systems integration and connectivity segments. Financial terms of the transaction were not disclosed.

Read More


Latest Articles

  • Implementing Functional Safety Requirements

    Implementing Functional Safety Requirements

    The Safety Functional Requirements Specification (SFRS; sometimes referred to as SRS or Safety Requirements Specification) is the plan for the safety controls on a machine and is the second step of the safety lifecycle. The SFRS document serves as a framework for the safety control system design, is informed by prior work done in the… Read More…

  • From Endress+Hauser, 24/7 Digital, Plant-Wide Health Monitoring for Rockwell Systems Optimizes Workflows and Processes

    From Endress+Hauser, 24/7 Digital, Plant-Wide Health Monitoring for Rockwell Systems Optimizes Workflows and Processes

    Endress+Hauser’s Asset Health Monitoring Solution–Rockwell Edition, now available for installation, provides operators with a centralized, digital overview of plant-wide device health to avoid unscheduled shutdowns and accelerate troubleshooting. It not only presents early visibility of problematic devices but distinguishes itself by adding likely causes and remedies to such a report so problems can be fixed… Read More…