Balluff Wafer Mapping Sensor Delivers Precision in the Smallest Spaces

January 17, 2020

Balluff’s new wafer mapping sensor, BOH00EZ, utilizes a highly precise photoelectric sensor for quick and reliable detection of semiconductor wafers and slotting errors in FOUPS – front opening unified pods. Especially designed for use with extremely thin end effectors, it features an extremely controlled and focused light spot, allowing it to detect wafers even just a few μm thick with extreme precision.

Based on photoelectric Micromote technology, it features the smallest LED sensor on the market in an impressively small sensor head – measuring in at just 2.4 x 1.5 x 7 mm.  This allows it to deliver precision in even the smallest spaces.

In addition to wafer mapping, this sensor delivers capabilities that can be used for a variety of applications that require through beam sensors in a small area, such as Life Science and Food and Beverage applications.

Key features:

  • –   Multi-functional sensor head
  • –   Smallest LED sensor on the market
  • –   Very compact, extremely flexible sensor cable
  • –   Flexible adaptation to the respective application using an external amplifier

Learn more at: www.balluff.com.

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