Phoenix Contact: Electronics Housings for Complex I/O Applications

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July 8, 2021

Phoenix Contact is introducing new lower housing parts with a greater installation depth for its modular DIN rail housings with front connection technology.

The ME-IO series electronics housings create space for a larger PCB area and the electronics it holds. You can therefore also realize highly complex automation concepts. The maximum PCB area per module width of 18.8 mm is approx. 8,500 mm². The L-design of the lower housing part makes them ideal for the flush integration of standard interfaces such as RJ45. Moreover, the wide design allows the integration of modern TFT and touch displays for controllers. Phoenix Contact is introducing new 8-position DIN rail connectors for the ICS and ME-IO series electronics housings to allow module-to-module communication. The bus connector allows the combination of both housing series, thus making tailored I/O and IoT applications possible.

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